K系列真空回流焊系统将稳定、大容量的热风回流焊与真空焊接功能集成在一起。它为客户提供了一种自动化的在线解决方案,可提供低空洞性能(总空洞面积)<5%), high throughput, and eco-friendly operation. The vacuum module is installed directly within the reflow oven, allowing for precise control of evacuation speeds and the execution of standard reflow temperature profiles to achieve in-line soldering.
主要特点 降低生产成本 |提高焊接质量